MCM Interconnect Power Consumption in an S-domain RLC Transmission Line Model

CHINESE JOURNAL OF COMPUTATIONAL PHYSICS ›› 2006, Vol. 23 ›› Issue (6): 753-756.

MCM Interconnect Power Consumption in an S-domain RLC Transmission Line Model

DONG Gang, YANG Yin-tang, LI Yue-jin

Key Laboratory of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, Microrelectronics Institute, Xidian University, Xi'an 710071, China

Received:2005-07-05 Revised:2005-11-29 Online:2006-11-25 Published:2006-11-25
Supported by:
Advanced Research Foundation for National Defence of China(NO.41323020204)

Abstract

CLC Number:

TN405.97

DONG Gang, YANG Yin-tang, LI Yue-jin. MCM Interconnect Power Consumption in an S-domain RLC Transmission Line Model[J]. CHINESE JOURNAL OF COMPUTATIONAL PHYSICS, 2006, 23(6): 753-756.

[1]	WANG Ning, DONG Gang, YANG Yintang, WANG Zeng, WANG Fengjuan, DING Can. Thermoelectric Analysis of Interconnect Considering Via and Fringing Effects [J]. CHINESE JOURNAL OF COMPUTATIONAL PHYSICS, 2012, 29(1): 108-114.
[2]	DONG Gang, CHAI Changchun, WANG Ying, LENG Peng, YANG Yintang. A Repeater Insertion Delay Optimized Method with Interconnect Temperature Distribution [J]. CHINESE JOURNAL OF COMPUTATIONAL PHYSICS, 2011, 28(1): 152-158.

MCM Interconnect Power Consumption in an S-domain RLC Transmission Line Model

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