CHINESE JOURNAL OF COMPUTATIONAL PHYSICS ›› 2014, Vol. 31 ›› Issue (1): 109-114.

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An Interconnect Energy Distribution Model Based on Non-uniform Wire-size

ZHANG Yan, DONG Gang, YANG Yintang, LI Yuejin   

  1. Key Laboratory of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices Microelectronics Institute, Xidian University, Xi'an 710071, China
  • Received:2013-03-04 Revised:2013-06-06 Online:2014-01-25 Published:2014-01-25

Abstract: Based on interconnection transmission differential equation,transform voltage and current expressions are derived by incorporating appropriate boundary conditions for interconnect energy analysis.We considered a practical transmission line with driver and load to find out relation between transform input and output voltage and current responses.Interconnection energy distribution is obtained,which considers non-ideal step stimulation.In 65 nm CMOS process,the non-uniform interconnect analytic model enables to estimate energy within 5% compared with Hspice simulations.The method has high accuracy.The analytic model can be applied to front end optimizing design and analysis of high performance global interconnection.

Key words: VLSI, distributed interconnection, non-uniform interconnect, exponential step stimulation, energy distribution

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