计算物理 ›› 2014, Vol. 31 ›› Issue (1): 109-114.

• 论文 • 上一篇    下一篇

一种非均匀线型的互连线能量分布模型

张岩, 董刚, 杨银堂, 李跃进   

  1. 西安电子科技大学微电子所, 宽禁带半导体材料与器件教育部重点实验室, 陕西 西安 710071
  • 收稿日期:2013-03-04 修回日期:2013-06-06 出版日期:2014-01-25 发布日期:2014-01-25
  • 作者简介:张岩(1982-),女,博士生,主要从事集成电路互连线性能研究及优化,E-mail:zylap@aliyun.com
  • 基金资助:
    国家自然科学基金(60606006);陕西省科技统筹创新工程计划(011KTCQ01-19);国防预研基金(9140A23060111)资助项目

An Interconnect Energy Distribution Model Based on Non-uniform Wire-size

ZHANG Yan, DONG Gang, YANG Yintang, LI Yuejin   

  1. Key Laboratory of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices Microelectronics Institute, Xidian University, Xi'an 710071, China
  • Received:2013-03-04 Revised:2013-06-06 Online:2014-01-25 Published:2014-01-25

摘要: 基于互连线信号传输微分方程,推导非均匀互连线的电压和电流分布表达式,根据实际情况,考虑非理性激励提出包括前端驱动和后端负载的二端口非均匀互连电路各部分能量分布表达式.基于65 nm CMOS工艺参数,对方法进行计算仿真验证,计算结果与Hspice仿真结果比较误差小于5%,具有很高的精度.该方法适用于高性能全局互连的前端优化设计分析.

关键词: 超大规模集成电路, 分布式互连, 非均匀互连, 指数型阶跃激励, 能量分布

Abstract: Based on interconnection transmission differential equation,transform voltage and current expressions are derived by incorporating appropriate boundary conditions for interconnect energy analysis.We considered a practical transmission line with driver and load to find out relation between transform input and output voltage and current responses.Interconnection energy distribution is obtained,which considers non-ideal step stimulation.In 65 nm CMOS process,the non-uniform interconnect analytic model enables to estimate energy within 5% compared with Hspice simulations.The method has high accuracy.The analytic model can be applied to front end optimizing design and analysis of high performance global interconnection.

Key words: VLSI, distributed interconnection, non-uniform interconnect, exponential step stimulation, energy distribution

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