Abstract: With through silicon via(TSV) area scale factor r,an analytical thermal model for top layer of three-dimensional integrated circuits(3D IC) taking TSV into account was proposed.It is shown that temperature is lower after considering TSVs under same working conditions;the greater the scale factor r,the lower the temperature is;For more layers and smaller r,temperature increases sharply with decrease of r;The best range of TSV area ratio factor r is 0.5% to 1% for an 8-layer 3D IC.

Key words: three-dimensional integrated circuit, through silicon via, thermal model, top layer, thermal management