CHINESE JOURNAL OF COMPUTATIONAL PHYSICS ›› 2012, Vol. 29 ›› Issue (6): 938-942.

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Temperature Characteristics of Three-dimensional Chip-multiprocessors

WANG Fengjuan, YANG Yintang, ZHU Zhangming, WANG Ning, ZHANG Yan   

  1. School of Microelectronics, Xidian University, Xi'an 710071, China
  • Received:2012-02-13 Revised:2012-05-24 Online:2012-11-25 Published:2012-11-25

Abstract: An expression of thermal resistance matrix is given.Transient temperature characteristics of three-dimensional chip-muhiprocessors(3D-CMP) are studied.Effect of heat capacity,thermal resistance and power consumption on temperature is analyzed. It shows that steady temperature of 3D-CMP is limited effectively by reducing thermal resistance and power consumption.Heat capacity influences rise time of temperature.It does not affect steady temperature.

Key words: chip-muhiprocessor, thermal resistance matrix, three-dimensional integration, temperature

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