Chinese Journal of Computational Physics ›› 2025, Vol. 42 ›› Issue (1): 90-97.DOI: 10.19596/j.cnki.1001-246x.8779

• Research Article • Previous Articles     Next Articles

Study of Glass Formation Ability and Evolution of Microstructure of Ag-Cu Alloy

Hengbo TAN1(), Shuangxiang QI2, Bei CHEN3, Ming GAO1, Dadong WEN1, Tao LIU3, Yonghe DENG1,*()   

  1. 1. School of Computational Science and Electronics, Hunan Institute of Engineering, Xiangtan, Hunan 411104, China
    2. Ningbo Dongda Shenle Electrical Alloy CO., LTD, Ningbo, Zhejiang 315506, China
    3. School of Physics and Mechanical & Electrical Engineering, Jishou University, Jishou, Hunan 416000, China
  • Received:2023-06-12 Online:2025-01-25 Published:2025-03-08
  • Contact: Yonghe DENG

Abstract:

The rapid solidification process of liquid Ag-Cu alloy at different solute concentrations are simulated by molecular dynamics method. The microstructure evolution characteristic of Ag-Cu alloy is analyzed by two-body distribution function, Honeycutt-Andersen bond type index and extended cluster type index method (CTIM). The results show that the main bond type of Ag-Cu quick setting glass alloy is 1551, and the local quintic symmetry are obvious. The main atomic configuration is icosahedral clusters, in which the regular icosahedral cluster (12 12/1551) is dominant. The highest heritable fraction f of Ag-Cu corresponds to the transition temperature of reduced glass, which proves that Ag60Cu40 has the best amorphous forming ability.

Key words: Ag-Cu alloy, microstructure, evolution, heritable fraction, glass forming ability