×
模态框（Modal）标题
在这里添加一些文本
Close
Close
Submit
Cancel
Confirm
×
模态框（Modal）标题
在这里添加一些文本
Close
×
导航切换
CJCP
Home
About Journal
About Journal
Information
Aims & Scopes
Journal History
Editorial Board
Editorial Board
Successive Editorial Board
Authors
Guidelines for Authors
Authors Login
Download
Online First
Reviewers
Peer Review
Editor Work
Editor-in-chief
Guidelines for Reviewers
FAQ
FAQ
Contacts us
中文
A Thermal Model for Top Layer of Three-dimensional Integrated Circuits with Through Silicon Via
WANG Fengjuan, ZHU Zhangming, YANG Yintang, WANG Ning
CHINESE JOURNAL OF COMPUTATIONAL PHYSICS . 2012, (
4
): 580 -584 .
