In this paper, the phase field crystal method is employed to simulate and study the inhibition effect of the growth of Kirkendall voids at the interface of metal micro interconnection structures during the deformation process. The effect of bidirectional constant rate of strain on the microstructure evolution and growth kinetics of Kirkendall voids with different orientation differences at the symmetric interface of metal micro interconnects is mainly studied. The research results show that the interface of the metal micro interconnect structure has a tendency of amorphization under the action of bidirectional constant rate of strain, and the atomic mismatch and defect density of the interface increase, thereby inhibiting the growth of Kirkendall voids. The bidirectional constant rate of strain does not change the nucleation mode of Kirkendall voids in the case of symmetric interface orientation, and the nucleation modes of Kirkendall voids are all grain boundary nucleation after the system nucleation point is saturated. The Kirkendall voids are uniformly distributed at the small-angle symmetrical and large-angle symmetrical interfaces of the metal micro interconnect structure. The average size and area of Kirkendall voids increase with evolution time. The average size, area and growth index of Kirkendall voids gradually decrease with the increase of the misorientation of the small-angle symmetric interface. The average size and area of Kirkendall voids gradually decrease with the increase of the misorientation of the large-angle symmetric interface, while the growth index increases. The bidirectional constant rate of strain can effectively reduce the growth size and area of Kirkendall voids, inhibit the growth of Kirkendall voids, and improve the reliability of metal micro interconnect structures.