计算物理 ›› 2003, Vol. 20 ›› Issue (5): 434-438.

• 论文 • 上一篇    下一篇

重离子微束单粒子翻转与单粒子烧毁效应数值模拟

郭红霞, 陈雨生, 周辉, 贺朝会, 耿斌, 李永宏   

  1. 西北核技术研究所, 陕西 西安 710024
  • 收稿日期:2002-05-24 修回日期:2002-12-17 出版日期:2003-09-25 发布日期:2003-09-25
  • 作者简介:郭红霞(1964-),女,山西太原,副研,博士,主要从事半导体器件辐照效应研究,西安69信箱13分箱三室.

Numerical Simulation of Heavy Ion Microbeam for Effects of Single Event Upset and Single Event Burnout

GUO Hong-xia, CHEN Yu-sheng, ZHOU Hui, HE Chao-hui, GENG Bin, LI Yong-hong   

  1. Northwest Institute of Nuclear Technology, Xi'an 710024, China
  • Received:2002-05-24 Revised:2002-12-17 Online:2003-09-25 Published:2003-09-25

摘要: 用束径0.4μm的微束重离子数值模拟了单粒子翻转SEU和单粒子烧毁效应SEB.单粒子翻转给出了不同离子注入后漏区的电压(电流)随时间变化规律;计算了CMOSSRAM电路的单粒子翻转;给出了收集电荷随LET值的变化曲线并给出了某一结构器件的临界电荷;VDMOS器件单粒子烧毁给出了不同时刻沿离子径迹场强、电位线、电流和碰撞离化率的变化.

关键词: 重离子微束, 单粒子翻转, 单粒子烧毁, 数值模拟

Abstract: Effects of SEU and SEB are simulated with 0.4μm diameter microbeam. SEU for drain region of MOSFET and CMOS SRAM are calculated. Collective charge depending on LET for specific device structure is calculated for different ions. LET and critical charge are provided. SEB for VDMOS is simulated and electric field, potential line, current, rate of impact ionization are given at different times along ion tracks. It is very important for heavy microbeam test physics models which have been set up.

Key words: heavy ion microbeam, single event upset, single event burnout, numerical simulation

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